Samsung Engineering signs MOU with AspenTech for digital innovation
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Samsung Engineering signs MOU with AspenTech for digital innovation
  • Kevin Lee 기자
  • 승인 2020.11.10 10:52
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Samsung Engineering CEO Choi Sung-an (far right) and AspenTech CEO Antonio Pietri (screen) sign a MOU through an online video system. /Courtesy of Samsung Engineering
Samsung Engineering CEO Choi Sung-an (far right) and AspenTech CEO Antonio Pietri (screen) sign a MOU through an online video system. /Courtesy of Samsung Engineering

 

Samsung Engineering signed a memorandum of understanding (MOU) with AspenTech, a global company in process asset solution software, on "optimizing plant operations based on digital technology," the company said on Nov. 9.

Samsung Engineering CEO Choi Sung-an and AspenTech CEO Antonio Pietri attended the signing ceremony held through an online video system.

The U.S.–based AspenTech develops and supplies solution programs that optimize the lifecycle, including the design, operation and maintenance of process assets.

Aspentech is a leading company in this field with a combination of modeling technology and AI that it has accumulated for more than 30 years.

The agreement calls for cooperation in optimizing the operation of the plant by utilizing AspenTech's digital solution program and Samsung Engineering's FEED (Basic Design) experience and capabilities.

The two companies have been recognized for their technical skills by applying them on a trial basis to major client sites last year, and they plan to expand the scope through this agreement.
Samsung Engineering expects to build a strong partnership by providing operating know-how using digital technology to its owner at plant sites built with the best EPC technology.

A Samsung Engineering official said, "We will secure competitive edge in carrying out our business through digital innovation based on technological competitiveness.”


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